Development and electrical performance of low temperature Cu-Sn/In bonding for 3D flexible substate integration

Yu Chen Hu, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

An innovative bonding approach applied to flexible substrate bonding is proposed in this research. Thin-film metal pad is fabricated as bonding medium to provide vertical stacking. As compared to other bonding methods, such as anisotropic conductive film (ACF) or non-conductive paste (NCP), thin-film metal pad bonding approach provides the most attractive advantage of fine-pitch. The bonding condition at low temperature exhibits good electrical performance, proving its great potential in the applications of flexible substrate stacking.

Original languageEnglish
Title of host publication2016 IEEE Silicon Nanoelectronics Workshop, SNW 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages164-165
Number of pages2
ISBN (Electronic)9781509007264
DOIs
StatePublished - 27 Sep 2016
Event21st IEEE Silicon Nanoelectronics Workshop, SNW 2016 - Honolulu, United States
Duration: 12 Jun 201613 Jun 2016

Publication series

Name2016 IEEE Silicon Nanoelectronics Workshop, SNW 2016

Conference

Conference21st IEEE Silicon Nanoelectronics Workshop, SNW 2016
CountryUnited States
CityHonolulu
Period12/06/1613/06/16

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