Abstract
We demonstrate that it is possible to extract the defect density distribution within the entire energy gap of a poly-Si layer by using a novel Schottky barrier thin-film transistor test structure. Our methodology, albeit based on the well-known field-effect conductance method, does not require two separate n- and p-channel test devices necessary in the conventional methods. This unique and much simplified single-test-device feature is made possible thanks to the ambipolar characteristics and the suppression of sub-threshold leakage current in the new test scheme. Effects of process treatments such as plasma hydrogenation could also be clearly resolved using the new test structure.
Original language | English |
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Journal | Electrochemical and Solid-State Letters |
Volume | 8 |
Issue number | 9 |
DOIs | |
State | Published - 29 Sep 2005 |