Design of flip-chip interconnects with vertical coaxial transitions and its fabrication

Wei Cheng Wu*, Ruey Bing Huang, Heng-Tung Hsu, Edward Yi Chang, Li Han Hsu, Chen Hua Huang, Yin Chu Hu, Ming Iu Lai

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

In this paper, a novel design of interconnect structure for CPW to CPW using the vertical "coaxial transition" is presented. The signal continuity is greatly improved since the coaxial-type transition provides more return current paths compared to the conventional transition using solder bumps. The design criteria of the vertical coaxial transitions for high frequency applications are described, and the key parameters in the coaxial transition structure are also discussed. CPW-to-CPW interconnect structure using the proposed coaxial transition was in-house fabricated. With proper design, the coaxial transition exhibits much better performance than the conventional one for very broadband applications.

Original languageEnglish
Title of host publicationAPMC 2005
Subtitle of host publicationAsia-Pacific Microwave Conference Proceedings 2005
DOIs
StatePublished - 1 Dec 2005
EventAPMC 2005: Asia-Pacific Microwave Conference 2005 - Suzhou, China
Duration: 4 Dec 20057 Dec 2005

Publication series

NameAsia-Pacific Microwave Conference Proceedings, APMC
Volume2

Conference

ConferenceAPMC 2005: Asia-Pacific Microwave Conference 2005
CountryChina
CitySuzhou
Period4/12/057/12/05

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