Design of an on-scribe-line 12-bit dual-slope ADC for wafer acceptance test

Hao-Chiao Hong, Long Yi Lin, Chun Jung Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Advanced technology suffers from more severe local process variation and thus requires measuring sufficient process control monitoring (PCM) devices to provide reliable wafer acceptance test (WAT) results. Adopting a large-scale device array with multiplexers can measure more PCM samples at a probe without increasing the pad count. Integrating a high-resolution and robust analog-To-digital converter (ADC) with the PCM circuits to replace the high-end ATE further reduces the test cost. It also alleviates the parasitic effects and thus accelerates the test and enhance the measurement accuracy. However, the on-wafer ADC design for WAT needs to be placed within the scribe line of the wafer. This work proposes a 12-bit dual-slope ADC that meets all the requirements for the aforementioned WAT scenario. The proposed switched-capacitor implementation makes the ADC robust against PVT variations. A test chip has been designed and fabricated in 0.18um CMOS. The active area of the proposed ADC is only 57 um by 581 um which well fits the narrow scribe line. Measurement results show the DNL and INL values are within +1.04/-0.8 and +1.83/-1.72 LSB, respectively. The ADC totally consumes 4.6 mW when operates at 3.3V and 3.2 kS/s.

Original languageEnglish
Title of host publicationProceedings of the 2017 IEEE International Conference on Applied System Innovation
Subtitle of host publicationApplied System Innovation for Modern Technology, ICASI 2017
EditorsTeen-Hang Meen, Artde Donald Kin-Tak Lam, Stephen D. Prior
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1751-1754
Number of pages4
ISBN (Electronic)9781509048977
DOIs
StatePublished - 21 Jul 2017
Event2017 IEEE International Conference on Applied System Innovation, ICASI 2017 - Sapporo, Japan
Duration: 13 May 201717 May 2017

Publication series

NameProceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017

Conference

Conference2017 IEEE International Conference on Applied System Innovation, ICASI 2017
CountryJapan
CitySapporo
Period13/05/1717/05/17

Keywords

  • Dual-slope ADC
  • Large-scale transistor array
  • Wafer acceptance test

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    Hong, H-C., Lin, L. Y., & Liu, C. J. (2017). Design of an on-scribe-line 12-bit dual-slope ADC for wafer acceptance test. In T-H. Meen, A. D. K-T. Lam, & S. D. Prior (Eds.), Proceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017 (pp. 1751-1754). [7988280] (Proceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICASI.2017.7988280