Design of AC-coupled circuit for high-speed interconnects

Chun Wei Huang*, Kai Jen Liu, Yu Jung Huang, Ming Kun Chen, Yi Lung Lin, Ming-Dou Ker

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

The scaling of semiconductor technology together with 3D IC stacking integration make it possible for many portable electronics to process large amount of multimedia data. AC-coupling enables chip placed face-to-face for signal transmission using close-field capacitive coupling. A high performance system design using AC coupled interconnect (ACCI) technology not only achieves shorter and faster interconnection between dies but also increases packaging density. This paper describes a chip-to-chip circuit design suitable for high-speed 3DIC interconnected applications. The AC-Coupled face-to-face (F2F) chip was simulated using HSPICE with TSMC 0.18-μm 1P6M CMOS technology process file under a 1.8 V supply voltage. The simulation results indicated the proposed circuit with the self-test characteristics can achieve differential signal transmission up to 2.5 Gbps.

Original languageEnglish
Title of host publication2012 IEEE Global High Tech Congress on Electronics, GHTCE 2012
Pages87-90
Number of pages4
DOIs
StatePublished - 1 Dec 2012
Event2012 IEEE Global High Tech Congress on Electronics, GHTCE 2012 - Shenzhen, China
Duration: 18 Nov 201220 Nov 2012

Publication series

Name2012 IEEE Global High Tech Congress on Electronics, GHTCE 2012

Conference

Conference2012 IEEE Global High Tech Congress on Electronics, GHTCE 2012
CountryChina
CityShenzhen
Period18/11/1220/11/12

Keywords

  • AC-Coupled
  • Differential signal transmission
  • High-speed interconnected
  • Three-dimensional integrated circuit (3D IC)

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