Design of a dual-probe profilometer

Chiao Hua Cheng, Shao-Kang Hung, Chih Hsien Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper proposes a design of a dual-probe profilometer, which successfully utilizes a compensation method with two probe modules to scan a 200 nm step height standard sample with 5% scanning error. Compared with traditional profilometers, this design possesses high scanning precise performance without using large and heavy optical flats to increase the flatness when sample stage is moving. The experimental results show the compensation method is valid and can be applied in nano-scale scanning.

Original languageEnglish
Title of host publication2014 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2014 - Conference Proceedings
EditorsPasi Kallio
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages66-69
Number of pages4
ISBN (Electronic)9781479979233
DOIs
StatePublished - 9 Mar 2014
Event4th International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2014 - Taipei, Taiwan
Duration: 27 Oct 201431 Oct 2014

Publication series

Name2014 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2014 - Conference Proceedings

Conference

Conference4th International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2014
CountryTaiwan
CityTaipei
Period27/10/1431/10/14

Keywords

  • nanopositioner
  • optical lever
  • profilometer

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  • Cite this

    Cheng, C. H., Hung, S-K., & Lin, C. H. (2014). Design of a dual-probe profilometer. In P. Kallio (Ed.), 2014 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2014 - Conference Proceedings (pp. 66-69). [7057334] (2014 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2014 - Conference Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/3M-NANO.2014.7057334