Design guidelines for deep-submicrometer MOSFETs

M. C. Jeng*, J. Chung, J. E. Moon, G. May, P. K. Ko, Chen-Ming Hu

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

9 Scopus citations

Abstract

A comprehensive study of the performance and reliability constraints on the dimensions and power supply of deep-submicrometer non-LDD (lightly doped drain) n-channel MOSFETs is presented. Design guidelines extracted from experimental results are presented that are based on the following factors: short-channel effects; drain-induced barrier-lowering effects, off-state leakage currents, hot-electron reliability, time-dependent dielectric breakdown, current-driving capability, voltage gain, and switching speed. The relative importance of each mechanism for a given technology and design is examined. As an example, a set of design curves using typical performance and reliability criteria is provided for n-channel deep-submicrometer devices. With slight modifications, these design curves can also be extended to other technologies, including p-channel and LDD devices.

Original languageEnglish
Pages (from-to)386-389
Number of pages4
JournalTechnical Digest - International Electron Devices Meeting
DOIs
StatePublished - 1 Dec 1988
EventTechnical Digest - International Electron Devices Meeting 1988 - San Francisco, CA, USA
Duration: 11 Dec 198814 Dec 1988

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