Design, fabrication and actuation of thermal actuating XY stage

Chun Ying Lin*, Tsung Ying Tsai, Jin-Chern Chiou

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review


This work presents a thermal actuating XY-stage by using MEMS-based (micro-electro-mechanical system) technologies. The proposed stage is designed as a decoupling XY stage has dimensions of 8.8 × 8.8 × 0.2 mm 3 and contains a two-axis decoupling XY stage and has sufficient strength to suspend an image sensor used for anti-shaking function. The processes used to fabricate the stabilizer include Silicon on Isolator (SOI) process, inductively coupled plasma (ICP) processes and HF vapor process. The maximum actuating distance of the stage is larger than 25μm which is sufficient to resolve the shaking problem. Accordingly, the applied voltage for the 25μm moving distance is lower than 20volts. Moreover, the dynamic resonant frequency of the actuating device is 3.5 kHz.

Original languageEnglish
Title of host publication4th IEEE International NanoElectronics Conference, INEC 2011
StatePublished - 26 Sep 2011
Event4th IEEE International Nanoelectronics Conference, INEC 2011 - Tao-Yuan, Taiwan
Duration: 21 Jun 201124 Jun 2011

Publication series

NameProceedings - International NanoElectronics Conference, INEC
ISSN (Print)2159-3523


Conference4th IEEE International Nanoelectronics Conference, INEC 2011


  • MEMS
  • thermal actuator
  • XY stage

Fingerprint Dive into the research topics of 'Design, fabrication and actuation of thermal actuating XY stage'. Together they form a unique fingerprint.

Cite this