Design, fabrication and actuation of thermal actuating XY stage

Chun Ying Lin*, Tsung Ying Tsai, Jin-Chern Chiou

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This work presents a thermal actuating XY-stage by using MEMS-based (micro-electro-mechanical system) technologies. The proposed stage is designed as a decoupling XY stage has dimensions of 8.8 × 8.8 × 0.2 mm 3 and contains a two-axis decoupling XY stage and has sufficient strength to suspend an image sensor used for anti-shaking function. The processes used to fabricate the stabilizer include Silicon on Isolator (SOI) process, inductively coupled plasma (ICP) processes and HF vapor process. The maximum actuating distance of the stage is larger than 25μm which is sufficient to resolve the shaking problem. Accordingly, the applied voltage for the 25μm moving distance is lower than 20volts. Moreover, the dynamic resonant frequency of the actuating device is 3.5 kHz.

Original languageEnglish
Title of host publication4th IEEE International NanoElectronics Conference, INEC 2011
DOIs
StatePublished - 26 Sep 2011
Event4th IEEE International Nanoelectronics Conference, INEC 2011 - Tao-Yuan, Taiwan
Duration: 21 Jun 201124 Jun 2011

Publication series

NameProceedings - International NanoElectronics Conference, INEC
ISSN (Print)2159-3523

Conference

Conference4th IEEE International Nanoelectronics Conference, INEC 2011
CountryTaiwan
CityTao-Yuan
Period21/06/1124/06/11

Keywords

  • MEMS
  • thermal actuator
  • XY stage

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