In this study, cup-shaped copper sheets were developed to improve heat dispassion for high-power light emitting diodes (LEDs) array module (30 × 3, 4 × 4, and 5 × 5) using an electroplating technique. The cupshaped copper sheets were directly contacted with sapphire to enhance the heat dissipation of the chip itself. The lateral emitting light extraction and heat dissipation of high-power LEDs were enhanced and efficient. The surface temperature was not only decreasing but also uniform for each LED chip with the cup-shaped copper heat spreader adoption. The high thermal transmitting performance of cup-shaped copper heat spreader allows thermal resistance reducing 0.7, 0.6, and 0.7 K/W of 3 × 3, 4 × 4, and 5 × 5 LED array module, respectively. In addition, the light output power was increased of 14, 13, and 12% with 3 × 3, 4 × 4, and 5 × 5 LEDs array module using cup-shaped copper sheet at high current injection. High heat dissipation performance and light extraction were obtained by cup-shaped copper sheet with copper bulk and silver mirror.