Cu-based bonding technology for 3D integration applications

Kuan-Neng Chen*, Z. Xu, F. Liu, C. T. Ko, C. A. Cheng, W. C. Huang, H. L. Lin, C. Cabral, Z. C. Hsiao, N. Klymko, H. C. Fu, Y. H. Chen, J. Q. Lu, W. C. Lo

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

This paper summarizes and reports systematical studies of Cu-based bonding technology for 3D IC applications. Hybrid Cu-oxide and Cu-polymer bonding designs and schemes are investigated. Electrical performances and reliability of Cu bond structures provide important guidelines for future 3D IC applications.

Original languageEnglish
Title of host publication2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOIs
StatePublished - 1 Dec 2011
Event2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan
Duration: 31 Jan 20122 Feb 2012

Publication series

Name2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Conference

Conference2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
CountryJapan
CityOsaka
Period31/01/122/02/12

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