Crosstalk evaluation, suppression and modeling in 3D through-strata-via (TSV) network

Zheng Xu*, Adam Beece, Dingyou Zhang, Qianwen Chen, Kuan-Neng Chen, Kenneth Rose, Jian Qiang Lu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

33 Scopus citations

Abstract

Through-strata-via (TSV) is regarded as a critical component in 3D integration that extends Moore's Law. This paper reports on TSV crosstalk performance under high speed operations using a 3D electromagnetic field solver and a SPICE simulator in both the frequency domain and time domain. Impacts of the rise time, the TSV pitch/height, the substrate resistivity and the guarding TSV termination on crosstalk noise are studied. Effects of adjacent aggressors and their switching patterns on time delay and peak noise of the victim TSV signal are evaluated. For large and dense TSV networks, crosstalk matrices of different TSV line/array arrangements are investigated at certain frequency points, detailing the coupling noise levels among these TSVs. Furthermore, the frequency dependent near-end crosstalk (NEXT) and far-end crosstalk (FEXT) are accurately modeled by SPICE tools.

Original languageEnglish
Title of host publicationIEEE 3D System Integration Conference 2010, 3DIC 2010
DOIs
StatePublished - 1 Dec 2010
Event2nd IEEE International 3D System Integration Conference, 3DIC 2010 - Munich, Germany
Duration: 16 Nov 201018 Nov 2010

Publication series

NameIEEE 3D System Integration Conference 2010, 3DIC 2010

Conference

Conference2nd IEEE International 3D System Integration Conference, 3DIC 2010
CountryGermany
CityMunich
Period16/11/1018/11/10

Keywords

  • 3D integration
  • Crosstalk
  • Modeling
  • TSV

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