Copper–Tin Reactions in Flip Chip Solder Joints

King Ning Tu*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

Abstract

In Chapters 2 and 3, we discussed solder reactions on bulk and thin-film Cu, respectively. In those reactions, there is only one interface between the solder and the Cu. However, in a solder joint there are two interfaces. Typically a solder joint joins two pieces of Cu tube together as in plumbing, or it joins two metallic contacts as in Si devices. These two interfaces in a fiip chip solder joint are not independent of each other from the point of view of interfacial reactions.

Original languageEnglish
Title of host publicationSpringer Series in Materials Science
PublisherSpringer Verlag
Pages111-125
Number of pages15
DOIs
StatePublished - 1 Jan 2007

Publication series

NameSpringer Series in Materials Science
Volume117
ISSN (Print)0933-033X
ISSN (Electronic)2196-2812

Keywords

  • Composite Solder Joint
  • Eutectic Solder
  • Solder Ball
  • Solder Bump
  • Solder Joint

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