Copper-to-copper direct bonding on highly (111) oriented nano-twinned copper in no-vacuum ambient

Jing Ye Juang*, Chia Ling Lu, Kuan Ju Chen, Tao Chih Chang, Chih Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

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Engineering & Materials Science