Copper-to-copper direct bonding on highly (111) oriented nano-twinned copper in no-vacuum ambient

Jing Ye Juang*, Chia Ling Lu, Kuan Ju Chen, Tao Chih Chang, Chih Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

In this study, we achieve the Cu-to-Cu direct bonding by using the (111) oriented nano-twined-Cu in N2 ambient, without vacuum condition and no additional thermal annealing treatment is needed. A well bonded interface under a temperature gradient between 400 °C and 100 °C was identified by the evidence of the grown grain across the bonding interface. In addition, a creep assisted bonding mechanism for the Cu-Cu direct bonding is proposed. Moreover, a shear test was applied on the bonded joints for the investigation of the bonded joint strength and its fracture mode. The mean value of joint strength is 176 MPa which is significantly higher than the conventional solder joint. In summary, the Cu-to-Cu direct bonding by (111) oriented nt-Cu in no-vacuum ambient as well as the grain evolution across the bonding interface has been achieved and verified.

Original languageEnglish
Title of host publicationIMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings
PublisherIEEE Computer Society
Pages199-201
Number of pages3
ISBN (Electronic)9781538647196
DOIs
StatePublished - 12 Jan 2018
Event12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017 - Taipei, Taiwan
Duration: 25 Oct 201727 Oct 2017

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume2017-October
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Conference

Conference12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017
CountryTaiwan
CityTaipei
Period25/10/1727/10/17

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  • Cite this

    Juang, J. Y., Lu, C. L., Chen, K. J., Chang, T. C., & Chen, C. (2018). Copper-to-copper direct bonding on highly (111) oriented nano-twinned copper in no-vacuum ambient. In IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings (pp. 199-201). (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; Vol. 2017-October). IEEE Computer Society. https://doi.org/10.1109/IMPACT.2017.8255959