Copper surface protection with a completely enclosed copper structure for a damascene process

T. C. Wang, Tsung-Eong Hsien, Y. L. Wang*, Y. L. Wu, K. Y. Lo, C. W. Liu, K. W. Chen

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

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Physics & Astronomy

Chemical Compounds

Engineering & Materials Science