Communication — Growth of <111> nanotwinned nickel films on <111> nanotwinned Cu substrates

Yi Cheng Chu, Chih Chen*

*Corresponding author for this work

Research output: Contribution to journalArticle

Abstract

Nickel has a high twinning energy of 110 MJ/m2, and it is thus difficult to fabricate nanotwinned Ni (nt-Ni) films. In this study, we adopt <111>-oriented nanotwinned Cu films as a substrate for the growth of nt-Ni films, and successfully electroplate <111>-oriented Ni films with densely-packed nanotwins. The average twin spacing is only 22 nm, while the grain size is over 1 μm. The nt-Ni film can be grown to a thickness of approximately 2.6 μm; beyond that, the Ni film becomes nanocrystalline. This approach provides a promising method to fabricate <111>-oriented nt-Ni films with controlled microstructures.

Original languageEnglish
Pages (from-to)P715-P717
JournalECS Journal of Solid State Science and Technology
Volume6
Issue number10
DOIs
StatePublished - 3 Oct 2017

Fingerprint Dive into the research topics of 'Communication — Growth of <111> nanotwinned nickel films on <111> nanotwinned Cu substrates'. Together they form a unique fingerprint.

  • Cite this