In recent years, Micro LED technology has been popularly developed. How to improve the issue of color stability in Micro LED technology is an important and also a difficult research topic. Here, the brightness decay and color displacement in high chip temperature are the two major factors in the color quality of Micro LED display image. In this paper, the technique of thin metal package is applied in the LED package to effectively improve the material thermal resistance of the LED package. By improving the material thermal resistance of the LED package, it could improve the brightness decay 5% in LED high junction temperature. The proposed method could reduce 0.01 of Cx displacement in LED high junction temperature and control Cy displacement less than 0.005 in chip junction temperature 45° to 110°. From the experimental results, the proposed method could exactly improve the color quality of quantum well Micro LED display image in high temperature.
- electronic packaging thermal
- thermal management of electronics
- Thin film devices