CMP network-on-chip overlaid with multi-band RF-interconnect

Mau-Chung Chang*, Jason Cong, Adam Kaplan, Mishali Naik, Glenn Reinman, Eran Socher, Sai Wang Tam

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

208 Scopus citations

Abstract

In this paper, we explore the use of multi-band radio frequency interconnect (or RF-I) with signal propagation at the speed of light to provide shortcuts in a many core network-on-chip (NoC) mesh topology. We investigate the costs associated with this technology, and examine the latency and bandwidth benefits that it can provide. Assuming a 400mm2 die, we demonstrate that in exchange for 0.13% of area overhead on the active layer, RF-I can provide an average 13% (max 18%) boost in application performance, corresponding to an average 22% (max 24%) reduction in packet latency. We observe that RF access points may become traffic bottlenecks when many packets try to use the RF at once, and conclude by proposing strategies that adapt RF-I utilization at runtime to actively combat this congestion.

Original languageEnglish
Title of host publicationProceedings - International Symposium on High-Performance Computer Architecture
Pages191-202
Number of pages12
DOIs
StatePublished - 24 Dec 2008
Event2008 IEEE 14th International Symposium on High Performance Computer Architecture, HPCA 2008 - Salt Lake City, UT, United States
Duration: 16 Feb 200820 Feb 2008

Publication series

NameProceedings - International Symposium on High-Performance Computer Architecture
ISSN (Print)1530-0897

Conference

Conference2008 IEEE 14th International Symposium on High Performance Computer Architecture, HPCA 2008
CountryUnited States
CitySalt Lake City, UT
Period16/02/0820/02/08

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