CMOS THz transmissive imaging system

Tzu Chao Yan, Chun Hsing Li, Chih Wei Lai, Wei Cheng Chen, Tzu Yuan Chao, Chien Nan Kuo

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

This paper presents a THz imaging system composed of a signal source and a signal sensor in CMOS technology. The signal source integrates a 338 GHz oscillator in 40-nm CMOS and an antenna array on a Benzocyclobutene (BCB) carrier using the SoP (System-on-Package) technique. The measured EIRP achieves +8 dBm. The signal sensor is implemented in 0.18 μm CMOS. The measured maximum responsivity is 632 kV/W at 332 GHz. The signal source and signal sensor consume dc power of 37.5 mW and 7.92 mW, respectively. The resolution of the proposed THz imaging system is 4 mm.

Original languageEnglish
Title of host publication2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages169-172
Number of pages4
ISBN (Electronic)9781479940905
DOIs
StatePublished - 13 Jan 2015
Event2014 10th IEEE Asian Solid-State Circuits Conference, A-SSCC 2014 - Kaohsiung, Taiwan
Duration: 10 Nov 201412 Nov 2014

Publication series

Name2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers

Conference

Conference2014 10th IEEE Asian Solid-State Circuits Conference, A-SSCC 2014
CountryTaiwan
CityKaohsiung
Period10/11/1412/11/14

Keywords

  • CMOS
  • signal sensor
  • signal source
  • System-on-Package (SoP)
  • THz imaging system

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