CMOS THz transmissive imaging system

Tzu Chao Yan; Chun Hsing Li; Chih Wei Lai; Wei Cheng Chen; Tzu Yuan Chao; Chien Nan Kuo

doi:10.1109/ASSCC.2014.7008887

CMOS THz transmissive imaging system

Tzu Chao Yan, Chun Hsing Li, Chih Wei Lai, Wei Cheng Chen, Tzu Yuan Chao, Chien Nan Kuo

Department of Electronics Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

This paper presents a THz imaging system composed of a signal source and a signal sensor in CMOS technology. The signal source integrates a 338 GHz oscillator in 40-nm CMOS and an antenna array on a Benzocyclobutene (BCB) carrier using the SoP (System-on-Package) technique. The measured EIRP achieves +8 dBm. The signal sensor is implemented in 0.18 μm CMOS. The measured maximum responsivity is 632 kV/W at 332 GHz. The signal source and signal sensor consume dc power of 37.5 mW and 7.92 mW, respectively. The resolution of the proposed THz imaging system is 4 mm.

Original language	English
Title of host publication	2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	169-172
Number of pages	4
ISBN (Electronic)	9781479940905
DOIs	https://doi.org/10.1109/ASSCC.2014.7008887
State	Published - 13 Jan 2015
Event	2014 10th IEEE Asian Solid-State Circuits Conference, A-SSCC 2014 - Kaohsiung, Taiwan Duration: 10 Nov 2014 → 12 Nov 2014

Publication series

Name	2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers

Conference

Conference	2014 10th IEEE Asian Solid-State Circuits Conference, A-SSCC 2014
Country	Taiwan
City	Kaohsiung
Period	10/11/14 → 12/11/14

Keywords

CMOS
signal sensor
signal source
System-on-Package (SoP)
THz imaging system

Access to Document

10.1109/ASSCC.2014.7008887

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Yan, T. C., Li, C. H., Lai, C. W., Chen, W. C., Chao, T. Y., & Kuo, C. N. (2015). CMOS THz transmissive imaging system. In 2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers (pp. 169-172). [7008887] (2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASSCC.2014.7008887

Yan, Tzu Chao ; Li, Chun Hsing ; Lai, Chih Wei ; Chen, Wei Cheng ; Chao, Tzu Yuan ; Kuo, Chien Nan. / CMOS THz transmissive imaging system. 2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 169-172 (2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers).

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title = "CMOS THz transmissive imaging system",

abstract = "This paper presents a THz imaging system composed of a signal source and a signal sensor in CMOS technology. The signal source integrates a 338 GHz oscillator in 40-nm CMOS and an antenna array on a Benzocyclobutene (BCB) carrier using the SoP (System-on-Package) technique. The measured EIRP achieves +8 dBm. The signal sensor is implemented in 0.18 μm CMOS. The measured maximum responsivity is 632 kV/W at 332 GHz. The signal source and signal sensor consume dc power of 37.5 mW and 7.92 mW, respectively. The resolution of the proposed THz imaging system is 4 mm.",

keywords = "CMOS, signal sensor, signal source, System-on-Package (SoP), THz imaging system",

author = "Yan, {Tzu Chao} and Li, {Chun Hsing} and Lai, {Chih Wei} and Chen, {Wei Cheng} and Chao, {Tzu Yuan} and Kuo, {Chien Nan}",

year = "2015",

month = jan,

day = "13",

doi = "10.1109/ASSCC.2014.7008887",

language = "English",

series = "2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "169--172",

booktitle = "2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers",

address = "United States",

note = "null ; Conference date: 10-11-2014 Through 12-11-2014",

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Yan, TC, Li, CH, Lai, CW, Chen, WC, Chao, TY & Kuo, CN 2015, CMOS THz transmissive imaging system. in 2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers., 7008887, 2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers, Institute of Electrical and Electronics Engineers Inc., pp. 169-172, 2014 10th IEEE Asian Solid-State Circuits Conference, A-SSCC 2014, Kaohsiung, Taiwan, 10/11/14. https://doi.org/10.1109/ASSCC.2014.7008887

CMOS THz transmissive imaging system. / Yan, Tzu Chao; Li, Chun Hsing; Lai, Chih Wei; Chen, Wei Cheng; Chao, Tzu Yuan; Kuo, Chien Nan.

2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 2015. p. 169-172 7008887 (2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - CMOS THz transmissive imaging system

AU - Yan, Tzu Chao

AU - Li, Chun Hsing

AU - Lai, Chih Wei

AU - Chen, Wei Cheng

AU - Chao, Tzu Yuan

AU - Kuo, Chien Nan

PY - 2015/1/13

Y1 - 2015/1/13

N2 - This paper presents a THz imaging system composed of a signal source and a signal sensor in CMOS technology. The signal source integrates a 338 GHz oscillator in 40-nm CMOS and an antenna array on a Benzocyclobutene (BCB) carrier using the SoP (System-on-Package) technique. The measured EIRP achieves +8 dBm. The signal sensor is implemented in 0.18 μm CMOS. The measured maximum responsivity is 632 kV/W at 332 GHz. The signal source and signal sensor consume dc power of 37.5 mW and 7.92 mW, respectively. The resolution of the proposed THz imaging system is 4 mm.

AB - This paper presents a THz imaging system composed of a signal source and a signal sensor in CMOS technology. The signal source integrates a 338 GHz oscillator in 40-nm CMOS and an antenna array on a Benzocyclobutene (BCB) carrier using the SoP (System-on-Package) technique. The measured EIRP achieves +8 dBm. The signal sensor is implemented in 0.18 μm CMOS. The measured maximum responsivity is 632 kV/W at 332 GHz. The signal source and signal sensor consume dc power of 37.5 mW and 7.92 mW, respectively. The resolution of the proposed THz imaging system is 4 mm.

KW - CMOS

KW - signal sensor

KW - signal source

KW - System-on-Package (SoP)

KW - THz imaging system

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T3 - 2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers

SP - 169

EP - 172

BT - 2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers

PB - Institute of Electrical and Electronics Engineers Inc.

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Yan TC, Li CH, Lai CW, Chen WC, Chao TY, Kuo CN. CMOS THz transmissive imaging system. In 2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers. Institute of Electrical and Electronics Engineers Inc. 2015. p. 169-172. 7008887. (2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers). https://doi.org/10.1109/ASSCC.2014.7008887