Charge transport mechanism of high-resistive state in RRAM based on SiO x

A. A. Gismatulin*, V. N. Kruchinin, V. A. Gritsenko, I. P. Prosvirin, T. J. Yen, Albert Chin

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

12 Scopus citations

Abstract

Nonstoichiometric silicon oxide SiO x is a promising material for developing a new generation of high-speed, reliable flash memory based on the resistive effect. It is necessary to understand the electron transport mechanism of the high-resistive state in SiO x to develop a resistive memory element. At present, it is generally accepted that the charge transport of the high-resistive state in the Resistive Random Access Memory (RRAM) is described by the Frenkel effect. In our work, the charge transport of the high-resistive state in RRAM based on SiO x is analyzed with two contact-limited and five volume-limited charge transport models. It is established that the Schottky effect model, thermally assisted tunneling, the Frenkel model of Coulomb trap ionization, the Makram-Ebeid and Lannoo model of multiphonon isolated trap ionization, and the Nasyrov-Gritsenko model of phonon-assisted tunneling between traps, quantitatively, do not describe the charge transport of the high-resistive state in the RRAM based on SiO x . The Shklovskii-Efros percolation model gives a consistent explanation for the charge transport of the high-resistive state in the RRAM based on SiO x at temperatures above room temperature.

Original languageEnglish
Article number033503
JournalApplied Physics Letters
Volume114
Issue number3
DOIs
StatePublished - 21 Jan 2019

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