Characterization of temporary bonding and laser release using polyimide and a 300-nm photolysis polymer system for high-throughput 3-D IC applications

Chuan An Cheng*, Tsung Yen Tsai, Yu Hsiang Huang, Chien Hung Lin, Chia Lin Lee, Shan Chun Yang, Kuan-Neng Chen

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

A new temporary bonding technology with an ultrafast laser-release process of less than 20 s is presented, where a 300-nm-thick photolysis polymer and polyimide are served as the release layer and adhesive layer, respectively. The submicrometer-thick polymer has the feature of high absorption of a 355-nm laser in contrast to polyimide during debonding procedures. In addition, the thin release layers of high chemical resistance and mechanical strength demonstrate their feasibility for handling process. Electrical characteristics of the devices before and after the laser-release process are investigated, showing no degradation. Thus, this technology scheme demonstrates its potential for temporary bonding and release in 3-D integration applications.

Original languageEnglish
Article number7820043
Pages (from-to)456-462
Number of pages7
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume7
Issue number3
DOIs
StatePublished - 1 Mar 2017

Keywords

  • 3-D integration
  • laser ablation
  • temporary bonding

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