Characterization of Silicon Photonics Modulator Integration and High Efficiency Testing Platform

Po Chih Chang, Shang Chun Chen*, Ting Hui Chen, Wei Yen Chen, Chih Hsiang Hsu, Chien Ying Huang, Kai Ning Ku, Ming Chang Lee, Tai Hsin Lee, Chen Yu Lin, Chien-Chung Lin, Chung Chih Wang, Sin Jhu Wun, Jie Zhang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We successfully establish a silicon photonics device manufacturing and testing platform in 200mm SOI wafer. We integrate modulator and driver chip to show 30Gb/s PAM4 capability. A fully-automatic wafer level characterization process is built up for all optical devices in surface coupling method.

Original languageEnglish
Title of host publicationGFP 2019 - Group IV Photonics
PublisherIEEE Computer Society
Number of pages2
ISBN (Electronic)9781728109053
DOIs
StatePublished - Aug 2019
Event16th IEEE International Conference on Group IV Photonics, GFP 2019 - Singapore, Singapore
Duration: 28 Aug 201930 Aug 2019

Publication series

NameIEEE International Conference on Group IV Photonics GFP
Volume2019-August
ISSN (Print)1949-2081

Conference

Conference16th IEEE International Conference on Group IV Photonics, GFP 2019
CountrySingapore
CitySingapore
Period28/08/1930/08/19

Keywords

  • modulator
  • silicon photonics
  • wafer level measurement

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    Chang, P. C., Chen, S. C., Chen, T. H., Chen, W. Y., Hsu, C. H., Huang, C. Y., Ku, K. N., Lee, M. C., Lee, T. H., Lin, C. Y., Lin, C-C., Wang, C. C., Wun, S. J., & Zhang, J. (2019). Characterization of Silicon Photonics Modulator Integration and High Efficiency Testing Platform. In GFP 2019 - Group IV Photonics [8853866] (IEEE International Conference on Group IV Photonics GFP; Vol. 2019-August). IEEE Computer Society. https://doi.org/10.1109/GROUP4.2019.8853866