Characterization of self-heating in advanced VLSI interconnect lines based on thermal finite element simulation

Sven Rzepka*, Kaustav Banerjee, Ekkehard Meusel, Chen-Ming Hu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

88 Scopus citations

Abstract

In this paper, self-heating of interconnects has been shown to affect the lifetime of next generation integrated circuits significantly more severely than today's. The paper proves the necessity for extending the system of design rules, proposes a thermal design rule, and presents an efficient and quantitatively accurate thermal simulator as tool for the design process.

Original languageEnglish
Pages (from-to)406-411
Number of pages6
JournalIEEE Transactions on Components Packaging and Manufacturing Technology Part A
Volume21
Issue number3
DOIs
StatePublished - 1 Jan 1998

Keywords

  • Advanced VLSI structures
  • Design rules
  • FEM
  • Interconnects
  • Reliability
  • Self-heating
  • Thermal modeling

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