In this paper, self-heating of interconnects has been shown to affect the lifetime of next generation integrated circuits significantly more severely than today's. The paper proves the necessity for extending the system of design rules, proposes a thermal design rule, and presents an efficient and quantitatively accurate thermal simulator as tool for the design process.
|Number of pages||6|
|Journal||IEEE Transactions on Components Packaging and Manufacturing Technology Part A|
|State||Published - 1 Jan 1998|
- Advanced VLSI structures
- Design rules
- Thermal modeling