Characterization of interconnect coupling noise using in-situ delay-change curve measurements

Takashi Sato*, Yu Cao, Dennis Sylvester, Chen-Ming Hu

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

14 Scopus citations


The delay-change curve (DCC) characterizes the variation the interconnect delay due to coupling noise. This paper describes a set of novel models that relate the DCC to the coupling noise waveform. These models are targeted for use in the timing margin design and accurate experimental determination of sub-nanosecond coupling noise. The circuit structure, a set of measurements, the model equations, and the waveform extraction procedures are newly proposed. Evaluation results using a 0.25-μm test chip are presented showing good agreement with SPICE simulations.

Original languageEnglish
Pages (from-to)321-325
Number of pages5
JournalProceedings of the Annual IEEE International ASIC Conference and Exhibit
StatePublished - 1 Jan 2000
EventProceedings of the 13th Annual IEEE International ASIC/SOC Conference - Arlington, VA, USA
Duration: 13 Sep 200016 Sep 2000

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