Characterization of a burn-in failure caused by a defective source driver on TFT-LCD panel

Fred S.C. Wang*, Keh La Lin, Ko Yang Tso, Chin Chieh Chao, Wai William Wang, Alan Yu, C. Y. Lee, Chien Hung Kuo, C. W.Arex Wang, Yi Chiu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper describes a thorough investigation to identify the root cause of an LCD panel burn-in failure induced by an LCD source driver, which is observed in a large-scale LCD factory producing more than one million LCD panels per month. The investigation demonstrates the effectiveness of the circuit simulation to precisely locate the defective spot which is caused by a metal slice originated from outer rings of an LCD COG (chip-on-glass) source driver. With the aid of emission microscope (EMMI), Energy Dispersive Analysis X-Ray (EDAX), and Chip Probing (CP) tester, the root cause of the failure is well explained. The formation mechanism of metal slice from the outer rings is thoroughly studied. A solution to completely eliminate the source of metal slices from the outer rings during wafer processing is also proposed.

Original languageEnglish
Title of host publicationProceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006
Pages171-174
Number of pages4
DOIs
StatePublished - 1 Dec 2006
Event13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006 - Singapore, Singapore
Duration: 3 Jul 20067 Jul 2006

Publication series

NameProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Conference

Conference13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006
CountrySingapore
CitySingapore
Period3/07/067/07/06

Keywords

  • ATE
  • Bit-line defect
  • COG
  • CP
  • DVS
  • EDAX
  • EMMI
  • LCD driver
  • Source driver
  • TFT-LCD
  • Two-step DAC

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