Characteristic improvement of inkjet printed Ag interconnects using tape on-off and mirror-reaction processes

Zi Li Guo, Yu Min Fu, Yu-Ting Cheng, Bor Yuan Shew, Pu-Wei Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

In the paper, we develop and implement the processes of tape on-off and Ag mirror-reaction to the previously developed size scalable inkjet printing process technique, i.e. CPLoP (Combined Process of Lift-off and Printing) for continuing its future interconnect applications in flexible microelectronics. The newly developed processes not only reduce coffee ring effect but also improve better electrical conductivity of the printed Ag interconnects at low process temperature. A 10μm wide Ag interconnect with flat surface morphology and low electrical resistivity, i.e. 7.7 μΩ · cm, has been realized.

Original languageEnglish
Title of host publicationProceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages41-44
Number of pages4
ISBN (Electronic)9781479999286, 9781479999286
DOIs
StatePublished - 25 Aug 2015
Event22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015 - Hsinchu, Taiwan
Duration: 29 Jun 20152 Jul 2015

Publication series

NameProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Volume2015-August

Conference

Conference22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015
CountryTaiwan
CityHsinchu
Period29/06/152/07/15

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