CDMA/FDMA-interconnects for future ULSI communications

Mau-Chung Chang*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

8 Scopus citations

Abstract

Future inter- and intra-ULSI interconnect systems demand extremely high data rates as well as bi-directional multi-I/O concurrent service, re-configurable computing/processing architecture, and total compatibility with mainstream silicon SOC (system-on-chip) and SIP (system-in-package) technologies. In this talk, we review recent advances in CDMA and FDMA interconnect schemes that promise to meet all of the above system requirements. The physical transmission line is no longer limited to a direct-coupled metal wire. Rather, it can be accomplished via either wired or wireless mediums through capacitor couplers that reduce the baseband noise and DC power consumption. These new advances in interconnect schemes would fundamentally alter the paradigm of ULSI data communications and enable the design of next generation computing/processing systems.

Original languageEnglish
Title of host publicationProceedings of theICCAD-2005
Subtitle of host publicationInternational Conference on Computer-Aided Design
Pages972-975
Number of pages4
DOIs
StatePublished - 1 Dec 2005
EventICCAD-2005: IEEE/ACM International Conference on Computer-Aided Design, 2005 - San Jose, CA, United States
Duration: 6 Nov 200510 Nov 2005

Publication series

NameIEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
Volume2005
ISSN (Print)1092-3152

Conference

ConferenceICCAD-2005: IEEE/ACM International Conference on Computer-Aided Design, 2005
CountryUnited States
CitySan Jose, CA
Period6/11/0510/11/05

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