Can AI help reliability analysis of 3D IC mobile devices?

King-Ning Tu, Yingxia Liu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In the big data era, the use of consumer electronic products in all aspects of our life is manifested by the ubiquitous presence of mobile devices. The continuing demand for smaller size, more functionality, lower power consumption, and reduced cost is challenging. A paradigm change, from 2D IC to 3D IC, is occurring in microelectronic industry. The stacking of thin chips makes Joule heating to be the most serious yield and reliability issue. However, to remove heat a temperature gradient must exist, but a difference of 1°C across a μ-bump of 10 μm in diameter has a temperature gradient of 1000 °C/cm, which can cause thermomigration. Furthermore, system level electromigration occurs in weak links, and fracture occurs in intermetallic μ-bumps. In this talk, how to use artificial intelligence (AI) for faster reliability study will be discussed.

Original languageEnglish
Title of host publication2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2018 - Proceedings
EditorsTing-Ao Tang, Fan Ye, Yu-Long Jiang
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538644409
DOIs
StatePublished - 5 Dec 2018
Event14th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2018 - Qingdao, China
Duration: 31 Oct 20183 Nov 2018

Publication series

Name2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2018 - Proceedings

Conference

Conference14th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2018
CountryChina
CityQingdao
Period31/10/183/11/18

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