Built-in self-test/repair methodology for multiband RF-Interconnected TSV 3D integration

Shu Feng Cheng, Po Tsang Huang, Li Chun Wang*, Mau Chung Frank Chang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Editor's note: Multiband radio-frequency interconnect (MRFI) is an emerging technology to achieve low-latency and energy-efficient on-chip communication. This article proposes a BIST method to improve the reliability of MRFI-based design. -Partha Pratim Pande, Washington State University.

Original languageEnglish
Article number8786260
Pages (from-to)63-71
Number of pages9
JournalIEEE Design and Test
Volume36
Issue number6
DOIs
StatePublished - Dec 2019

Keywords

  • BIST/R
  • e-fuse
  • multiband RF-Interconnect
  • phase error
  • PRBS
  • test methodology
  • TSV density
  • yield improvement

Fingerprint Dive into the research topics of 'Built-in self-test/repair methodology for multiband RF-Interconnected TSV 3D integration'. Together they form a unique fingerprint.

Cite this