Broadband flip-chip interconnects for millimeter-wave Si-carrier system-on-package

Chim Hsing Li*, Chang Tsimg Fu, Tzu Yuan Chao, Chien-Nan Kuo, Yu-Ting Cheng, D. C. Chang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

A flip-chip interconnect is proposed to achieve good electrical performance applicable to millimeter-wave applications. By Au-Au thermocompression technique, the transition structure provides continuity of characteristic impedance from the on-carrier CPW line to the on-chip microstrip line, as well as smooth current flow. Parameter optimization further indicates that the tapered reference ground connection is insensitive to the frequency response. Characterization of the structure is conducted by the THURREFLECT-LINE (TRL) calibration technique to test the flipchip interconnects up to 50GHz. Measurement results show that return loss is better than 15dB and insertion loss smaller than 1.7dB up to 50GHz. The broadband transition structure is suitable for high frequency application without any external matching network.

Original languageEnglish
Title of host publication2007 IEEE MTT-S International Microwave Symposium Digest
Pages1645-1648
Number of pages4
DOIs
StatePublished - 2 Oct 2007
Event2007 IEEE MTT-S International Microwave Symposium, IMS 2007 - Honolulu, HI, United States
Duration: 3 Jun 20078 Jun 2007

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
ISSN (Print)0149-645X

Conference

Conference2007 IEEE MTT-S International Microwave Symposium, IMS 2007
CountryUnited States
CityHonolulu, HI
Period3/06/078/06/07

Keywords

  • Coplanar waveguide
  • CPW
  • Flipchip devices
  • Microstrip

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