Bonding temperature optimization and property evolution of SU-8 material in metal/adhesive hybrid wafer bonding

Kuan-Neng Chen*, C. A. Cheng, W. C. Huang, C. T. Ko

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

Bonding temperature optimization of SU-8 material for metal/adhesive hybrid bonding was investigated. The good bond quality of SU-8 adhesive can be achieved with the bonding temperature between 150°C and 250°C, while bond failures of SU-8 wafers are observed starting from 275°C. IR transmittance spectra measurements indicate the croesslinks inside SU-8 break and further bond failure is observed due to the large decomposition of epoxy rings and phenyl in plane bending above 275°C. This research provides guidelines of material selection and bonding parameters for heterogeneous integration, 3DIC and MEMS applications using metal/adhesive hybrid bonding.

Original languageEnglish
Pages (from-to)6969-6972
Number of pages4
JournalJournal of Nanoscience and Nanotechnology
Volume11
Issue number8
DOIs
StatePublished - 1 Aug 2011

Keywords

  • Adhesive bonding
  • Hybrid bonding
  • SU-8
  • Wafer bonding

Fingerprint Dive into the research topics of 'Bonding temperature optimization and property evolution of SU-8 material in metal/adhesive hybrid wafer bonding'. Together they form a unique fingerprint.

Cite this