| Original language | English |
|---|---|
| Patent number | US 8,508,041 B2 |
| State | Published - 13 Aug 2013 |
BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-DIMENSIONAL INTEGRATED CIRCUIT THEREOF
Kuan-Neng Chen (Inventor)
Research output: Patent
Kuan-Neng Chen (Inventor)
Research output: Patent
| Original language | English |
|---|---|
| Patent number | US 8,508,041 B2 |
| State | Published - 13 Aug 2013 |