A new bond pad structure in CMOS technology with low capacitance for gigahertz radio frequency applications is proposed. Three kinds of inductors stacked under the pad are used in the proposed bond pad structure. Experimental results have verified that the bond pad capacitance is reduced due to the cancellation effect provided by the inductor embedded in the proposed bond pad structure. The new proposed bond pad structure is fully process-compatible to general CMOS processes without any extra process modification.
- Bond pad
- Radio frequency integrated circuit (RF IC)