Board- and chip-aware package wire planning

Ren Jie Lee, Hsin Wu Hsu, Hung-Ming Chen

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

The slow turnaround between design, package, and system houses has been one of the primary concerns in the semiconductor business. There is a serious lag in the development time of the systems due to time-consuming interface design between the chip, package, and board. In order to enable chip-package-board codesign to speed up the design process, we propose an approach to address this issue by efficiently planning wires for board and chip design awareness, which includes the package pin-out designation and the corresponding wire planning in package and board. We model the problem as an interval intersection problem. Because of the special need in pin-out rules, an algorithm to resolve the problem is developed. We then use some optimization techniques to further improve objectives such as global wire congestion and length deviation. Our results show that a very efficient estimation can be made considering those important objectives, and package congestion can be successfully mitigated.

Original languageEnglish
Article number6302280
Pages (from-to)1377-1387
Number of pages11
JournalIEEE Transactions on Very Large Scale Integration (VLSI) Systems
Volume21
Issue number8
DOIs
StatePublished - 1 Jan 2013

Keywords

  • Chip-package-board codesign
  • package congestion mitigation
  • package wire planning

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