EEPROM devices with either N-type or P-type floating gate were fabricated and characterized. Program/erase speeds and stress-induced leakage current-related retention characteristics for both types of devices are explained. Discrepancies between previously published reports on P-type floating gate devices and PMOS gate current measurements are resolved. The feasibility of integrating P-type floating gate EEPROMs in high density memory arrays is examined.
- Flash memories
- Nonvolatile semiconductor memories