Basic study on electromigration phenomena in pb-free solder joint

Masaru Fujiyoshi, Nobuhiko Chiwata, Jung Kyu Han, King-Ning Tu

Research output: Contribution to journalArticlepeer-review

Abstract

In flip chip technology, electromigration affects the reliability of the solder interconnections. When investigating electromigration in the solder joint, it is essential to examine the effective charge number (Z*) of the atoms involved in the electromigration. In this study, first, a solder joint with almost equivalent current crowding on electromigration was produced by using 1mm thick Cu plates. After that, nine markers were formed on the cross-sectioned solder joint. Then, the migration length of each marker was systematically measured under two conditions. The Z* of each marker was examined by the marker's migration length.

Original languageEnglish
Pages (from-to)159-163
Number of pages5
JournalJournal of Japan Institute of Electronics Packaging
Volume16
Issue number2
DOIs
StatePublished - 28 Jun 2013

Keywords

  • Current crowding
  • Effective charge number
  • Electromigration
  • Soldering

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