Basic study on electromigration phenomena in pb-free solder joint

Masaru Fujiyoshi, Nobuhiko Chiwata, Jung Kyu Han, King-Ning Tu

Research output: Contribution to journalArticlepeer-review


In flip chip technology, electromigration affects the reliability of the solder interconnections. When investigating electromigration in the solder joint, it is essential to examine the effective charge number (Z*) of the atoms involved in the electromigration. In this study, first, a solder joint with almost equivalent current crowding on electromigration was produced by using 1mm thick Cu plates. After that, nine markers were formed on the cross-sectioned solder joint. Then, the migration length of each marker was systematically measured under two conditions. The Z* of each marker was examined by the marker's migration length.

Original languageEnglish
Pages (from-to)159-163
Number of pages5
JournalJournal of Japan Institute of Electronics Packaging
Issue number2
StatePublished - 28 Jun 2013


  • Current crowding
  • Effective charge number
  • Electromigration
  • Soldering

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