The conventional PCB (Printed Circuit Board) DIP (Dual Inline Package) process solder defect detection was done by labor inspection, which is not only time-intensive but also labor-intensive. This paper proposes a deep ensemble method to inspect the PCB solder defects to replace the labor inspection. To achieve a high detection rate and a low false alarm rate, two distinct detection models, a hybrid YOLOv2 (YOLOv2 as a foreground detector and ResNet-101 as a classifier) and Faster RCNN with ResNet-101 and FPN are separately trained to obtain a high detection rate result. The final ensemble model aggregates the result from the two detection models. That achieves a 96.73% detection rate and a 19.73% false alarm rate in real tests. The detection time is less than 15 seconds for inferencing a PCB image with a resolution of 7296∗6000. The proposed method has been proven efficient in terms of guiding operators to identify and fix PCB solder defects  and thus is able to reduce 33% of labor demand for each PCB production line at our real test site. .