Asymmetry hybrid bonding using Cu/Sn bonding with polyimide for 3D heterogeneous integration applications

Yen Jun Huang, Hsiu Chi Chen, Ting Yang Yu, Bo Hung Lai, Yu Chiao Shih, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this work, hybrid bonding platform is successfully developed with solder bonding and photosensitive polyimide (PI) at 250 °C. Since solder may be affected by the curing process of polymer owing to its low melting point, an asymmetry hybrid bonding structure is proposed to overcome this issue. Metal and polymer can be well bonded simultaneously with wide integration flexibility through various ratios of polymer to metal. The mechanical strength of bonded structure is substantially improved with the better use of polymer filling in the extra areas between metal lines. The developed hybrid bonding structure shows excellent electrical characteristics and high wafer level uniformity. Furthermore, the bonded samples also show excellent reliability to endure temperature variation and humidity erosion after temperature cycling test and un-bias highly accelerated stress test. With the advantages of dielectric photosensitivity, excellent bonding qualities, high process flexibilities, strong mechanical strength, good electrical performance and high stability, the hybrid bonding structures have the outstanding potential to be used in future 3D heterogeneous applications.

Original languageEnglish
Title of host publicationIMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings
PublisherIEEE Computer Society
Pages187-190
Number of pages4
ISBN (Electronic)9781538647196
DOIs
StatePublished - 12 Jan 2018
Event12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017 - Taipei, Taiwan
Duration: 25 Oct 201727 Oct 2017

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume2017-October
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Conference

Conference12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017
CountryTaiwan
CityTaipei
Period25/10/1727/10/17

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