Asymmetrical growth of Cu 6Sn 5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints

Ming Yung Guo, C. K. Lin, Chih Chen*, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

51 Scopus citations

Abstract

We observed asymmetrical growth of Cu 6Sn 5 intermetallic compounds (IMCs) on the two interfaces of Cu/SnAg/Cu solder joints during reflow at 260 °C on a hot plate. The IMCs grew to 12.3 μm on the cold end and 3.5 μm on the hot end after reflow for 40 min. However, the consumption of Cu on the cold end is less than that on the hot end. We propose that rapid thermomigration of Cu is responsible for the asymmetrical growth of the IMCs. With the simulated thermal gradient of 51 °C/cm across the liquid solder, the heat of transport of Cu is calculated as 20 kJ/mol.

Original languageEnglish
Pages (from-to)155-158
Number of pages4
JournalIntermetallics
Volume29
DOIs
StatePublished - 1 Oct 2012

Keywords

  • A. Intermetallics, miscellaneous
  • B. Diffusion
  • B. Thermal properties
  • C. Joining

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