A novel out-of-plane assembly technique of 3-D microstructures is proposed and demonstrated by using simple vertical one-push operations. This one-push method has large probe positioning tolerance in both vertical and lateral directions to reduce the overall complexity of the assembly process. Micromirrors and corner cube reflectors are fabricated on silicon-on-insulator wafers using SU-8 photoresist as a second structure layer in a low-temperature process. Batch assembly of multiple mirrors assembled simultaneously is demonstrated.
|Number of pages||6|
|Journal||IEEE Journal on Selected Topics in Quantum Electronics|
|State||Published - 1 Sep 2009|
- Microelectromechanical system (MEMS)
- One push
- Out of plane