Assembly of micro-3-D components on SOI wafers using novel SU-8 locking mechanisms and vertical one-push operation

Yi Chiu*, Chang Shiou Wu, Wei Zhi Huang, Jhong Wei Wu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

A novel out-of-plane assembly technique of 3-D microstructures is proposed and demonstrated by using simple vertical one-push operations. This one-push method has large probe positioning tolerance in both vertical and lateral directions to reduce the overall complexity of the assembly process. Micromirrors and corner cube reflectors are fabricated on silicon-on-insulator wafers using SU-8 photoresist as a second structure layer in a low-temperature process. Batch assembly of multiple mirrors assembled simultaneously is demonstrated.

Original languageEnglish
Article number4982735
Pages (from-to)1338-1343
Number of pages6
JournalIEEE Journal on Selected Topics in Quantum Electronics
Volume15
Issue number5
DOIs
StatePublished - 1 Sep 2009

Keywords

  • Assembly
  • Hinge
  • Microelectromechanical system (MEMS)
  • One push
  • Out of plane

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