Application of ozone ashing dry technology in the fabrication of mesoporous silica film with ultra-low dielectric constant and high mechanical stability

A. T. Cho, Fu-Ming Pan, C. W. Yen, J. Y. Chen, Y. J. Chen, K. J. Chao

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Ozone ashing dry technology has been applied in the fabrication of mesoporous silica film with ultra-low dielectric constant. The process removes the organic template efficiently at relatively low temperature. The film has an ordered pore structure and uniform pore diameter, which lead to a good mechanical strength and better electrical reliability.

Original languageEnglish
Title of host publicationDigest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages264-265
Number of pages2
ISBN (Electronic)4891140402, 9784891140403
DOIs
StatePublished - 1 Jan 2003
EventInternational Microprocesses and Nanotechnology Conference, MNC 2003 - Tokyo, Japan
Duration: 29 Oct 200331 Oct 2003

Publication series

NameDigest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003

Conference

ConferenceInternational Microprocesses and Nanotechnology Conference, MNC 2003
CountryJapan
CityTokyo
Period29/10/0331/10/03

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