Application of Al/PI composite bumps to COG bonding process

Jen Huang Jeng*, Tsung-Eong Hsien

*Corresponding author for this work

Research output: Contribution to journalArticle

5 Scopus citations

Abstract

This work demonstrates the probing, testability and applicability of Al/PI (aluminum/polyimide) composite bumps to the chip-on-glass (COG) bonding process for liquid crystal display (LCD) driver chip packaging. The experimental results showed that the thickness of Al overlayer on PI core of the bump, the location of pin contact, and the bump configuration affect bump probing testability. The bump with type IV configuration prepared in this work exhibited excellent probing testability when its Al overlayer thickness exceeded 0.8 μm. We further employed Taguchi method to identify the optimum COG bonding parameters for the Al/PI composite bump. The four bonding parameters, bonding temperature, bonding time, bonding pressure and thickness of Al overlayer are identified as 180° C, 10 s, 800 kgf/cm2 and 1.4μm, respectively. The optimum bonding condition was applied to subsequent COG bonding experiments on glass substrates containing Al pads or indium tin oxide (ITO) pads. From the results of resistance measurement along with a series of reliability tests, Al pad is found to be good substrate bonding pad for Al/PI bump to COG process. Excellent contact quality was observed when the bumps had Al overlayer thickness over 1.1 μm. As to the COG specimens with substrate containing ITO pads, high joint resistance suggested that further contact quality refinement is necessary to realize their application to COG process.

Original languageEnglish
Pages (from-to)271-278
Number of pages8
JournalIEEE Transactions on Components and Packaging Technologies
Volume24
Issue number2
DOIs
StatePublished - 1 Jun 2001

Keywords

  • Al/PI composite bumps
  • Bonding
  • COG process
  • Probing testability
  • Reliability tests

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