Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints

Y. C. Liang, H. W. Lin, H. P. Chen, Chih Chen*, King-Ning Tu, Y. S. Lai

*Corresponding author for this work

Research output: Contribution to journalArticle

19 Scopus citations

Abstract

The evolution of eutectic structure under temperature cycling tests (TCTs) in SnPb composite solder joints has been investigated. After 500 cycles of TCT, the Sn grains coarsened and developed anisotropic stripes close to the necking site in the solder joint because of stress-induced atomic migration. Then, cracks triggered by thermal stress were observed to propagate along the Sn stripe interfaces. After a prolonged 14,410 cycles of TCT, the cracks expanded across the entire solder joint and led to electrical open failure.

Original languageEnglish
Pages (from-to)25-28
Number of pages4
JournalScripta Materialia
Volume69
Issue number1
DOIs
StatePublished - 1 Jul 2013

Keywords

  • Diffusion
  • SnPb composite solder joint
  • Stress migration
  • Temperature cycling test

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