Analytical and experimental verification of interleaved trapezoidal heat sink

Hong Long Chen, Chi-Chuan Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The objective of this paper is to explore the technique for lowering the contraction and hydraulic developing region pressure drop, in order to gain more airflow for electronic cooling heat sink for the same footprint and fin number. By combining two different geometrical perimeter shapes of fins, odd number is rectangular shape, and even number is trapezoidal shape, this new fin module design gains extra 10% airflow with little loss or equivalent thermal performance. Current data center server is suffering from too little airflow to cool essential chips due to enormous flow impedance for packing too many components inside. This technology is the solution to resolve this bottleneck. The precious extra 10% more airflow not only cools CPU chip itself; but also quite beneficial to cool other heating components inside servers. Also, this new design excels in low velocity of 2 m/s for thermal performance compared to original design. Lower velocity is equal to lower RPM of fan that leads to the advantage of energy saving.

Original languageEnglish
Title of host publication33rd Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2017 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages197-203
Number of pages7
ISBN (Electronic)9781538615317
DOIs
StatePublished - 11 Apr 2017
Event33rd Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2017 - San Jose, United States
Duration: 13 Mar 201717 Mar 2017

Publication series

NameAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
ISSN (Print)1065-2221

Conference

Conference33rd Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2017
CountryUnited States
CitySan Jose
Period13/03/1717/03/17

Keywords

  • Electronic cooling
  • Friction factor
  • Heat sink
  • Pressure drop

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  • Cite this

    Chen, H. L., & Wang, C-C. (2017). Analytical and experimental verification of interleaved trapezoidal heat sink. In 33rd Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2017 - Proceedings (pp. 197-203). [7896930] (Annual IEEE Semiconductor Thermal Measurement and Management Symposium). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SEMI-THERM.2017.7896930