Analytical and experimental verification of heat sink flow impedance for Interleaved Parallelogram Fin Module (IPFM) design

Hong Long Chen*, Chi-Chuan Wang

*Corresponding author for this work

Research output: Contribution to conferencePaper

Abstract

The objective of this paper is to explore the technique for lowering the contractional and hydraulic developing region pressure drop, in order to gain more airflow for electronic cooling heat sink for the same footprint and fin number. By combining two different geometrical perimeter shapes of fins, odd number is rectangular shape, and even number is parallelogram shape, this new fin module design gains extra 10% airflow with little loss or equivalent thermal performance from experimental result. This new technology is named as IPFM (Interleaved Parallelogram Fin Module). Current data center server is suffering from too little CFM to cool essential chips due to enormous flow impedance for packing too many components inside. The IPFM is the solution to resolve this bottleneck. The precious extra 10% more airflow not only cools CPU chip itself; but also quite beneficial to cool other heating component inside servers.

Original languageEnglish
StatePublished - 1 Jan 2016
Event8th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2016 - Taipei, Taiwan
Duration: 15 May 201617 May 2016

Conference

Conference8th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2016
CountryTaiwan
CityTaipei
Period15/05/1617/05/16

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  • Cite this

    Chen, H. L., & Wang, C-C. (2016). Analytical and experimental verification of heat sink flow impedance for Interleaved Parallelogram Fin Module (IPFM) design. Paper presented at 8th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2016, Taipei, Taiwan.