Analytical analysis and experimental verification of interleaved parallelogram heat sink

Hong Long Chen, Chi-Chuan Wang*

*Corresponding author for this work

Research output: Contribution to journalArticle

6 Scopus citations


In this study, a novel air-cooled heat sink profile is proposed to compete with the conventional design. The new design is termed as IPFM (Interleaved Parallelogram Fin Module) which features two different geometrical perimeter shapes of fins. This new design not only gains the advantage of lower pressure drop for power saving; but also gains a material saving for less fin surface area. An assessment of flow impedance and performance between the conventional and IPFM heat sink is analytically investigated and experimentally verified. A new modified dimensionless friction factor for triangular region is proposed. The analytical predictions agree with experimental measurements for both conventional and IPFM design. In electronic cooling design, especially for cloud server air-cooled heat sink design, the flow pattern is usually laminar with Reynolds number being operated less than 2000. In this regime, the IPFM design shows 8–12% less of surface than conventional design when the flow rate is less than 10 CFM; yet the thermal performance is slightly inferior to the conventional design when the flowrate is raised towards 25 CFM. Yet in the test range of 5–25 CFM, a 10–15% lower flow impedance is observed. The smaller fin spacing, the more conspicuous reduction of flow impedance is observed. The optimization of cutting angle is around 35° for 10 CFM, and it is reduced to 15° at a larger flowrate of 20 CFM.

Original languageEnglish
Pages (from-to)739-749
Number of pages11
JournalApplied Thermal Engineering
StatePublished - 5 Feb 2017


  • Analytical prediction
  • Flow impedance
  • Heat sink
  • Interleaved Parallelogram Fin Module
  • Thermal resistance

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