Analysis of ink ejection failure in a MEMS micro-injector printing head

In Yao Lee*, Tsung Ping Hsu, Wai W. Wang, Yi Chiu, Hua Kun Tang, Fan Chung Tseng, Kelvin Lee

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The failure mechanism of a monolithic MEMS twin-bubble micro-injector failing to eject ink smoothly is investigated. The nozzle plate structure is insufficient to resist the thermally induced stress, resulting in chamber wall crack and thus ink ejection failure. A stress model is proposed to explain the crack mechanism of this MEMS micro-injector. A solution to eliminate this problem and achieve satisfactory production yield of micro-injector print head is also reported.

Original languageEnglish
Title of host publication2007 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2007, Technical Proceedings
Pages133-136
Number of pages4
StatePublished - 23 Aug 2007
Event2007 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2007 - Santa Clara, CA, United States
Duration: 20 May 200724 May 2007

Publication series

Name2007 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2007, Technical Proceedings
Volume4

Conference

Conference2007 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2007
CountryUnited States
CitySanta Clara, CA
Period20/05/0724/05/07

Keywords

  • Inkject
  • MEMS
  • Print head
  • Reliability

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  • Cite this

    Lee, I. Y., Hsu, T. P., Wang, W. W., Chiu, Y., Tang, H. K., Tseng, F. C., & Lee, K. (2007). Analysis of ink ejection failure in a MEMS micro-injector printing head. In 2007 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2007, Technical Proceedings (pp. 133-136). (2007 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2007, Technical Proceedings; Vol. 4).