Analysis of crosstalk in packaged microwave circuits

Chien-Nan Kuo*, Bijan Houshmand, Tatsuo Itoh

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

Abstract

Crosstalk in a packaged multi-circuit system is simulated by applying the FDTD method using large-signal analysis. The capability of full-wave simulation is obtained by appropriate modeling of the device-wave interaction. Crosstalk of different input-power levels, thus, is examined by checking the output power.

Original languageEnglish
Pages193-195
Number of pages3
StatePublished - 1 Dec 1996
EventProceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging - Napa Valley, CA, USA
Duration: 28 Oct 199630 Oct 1996

Conference

ConferenceProceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging
CityNapa Valley, CA, USA
Period28/10/9630/10/96

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