Crosstalk in a packaged multi-circuit system is simulated by applying the FDTD method using large-signal analysis. The capability of full-wave simulation is obtained by appropriate modeling of the device-wave interaction. Crosstalk of different input-power levels, thus, is examined by checking the output power.
|Number of pages||3|
|State||Published - 1 Dec 1996|
|Event||Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging - Napa Valley, CA, USA|
Duration: 28 Oct 1996 → 30 Oct 1996
|Conference||Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging|
|City||Napa Valley, CA, USA|
|Period||28/10/96 → 30/10/96|