Analysis of bump resistance and electrical distribution of ultra-fine-pitch microbumps

Y. W. Chang, H. Y. Peng, R. W. Yang, Chih Chen*, T. C. Chang, C. J. Zhan, J. Y. Juang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

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Engineering & Materials Science