Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC

Wen Yu Lo*, Ming-Dou Ker

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

An abnormal failure mechanism due to ESD zapping on the Non-Connected (NC) balls of a 683-pin BGA packaged chipset IC is presented. Failure analyses, including Scanning Electronic Microscopy (SEM) photographs and the measurement of current waveforms during ESD zapping, had been performed with a new proposed equivalent circuit to give clear explanation on this unusual phenomenon. Several methods to prevent such failure mechanism are also discussed.

Original languageEnglish
Pages (from-to)1583-1588
Number of pages6
JournalMicroelectronics Reliability
Volume43
Issue number9-11
DOIs
StatePublished - 1 Sep 2003
Event14th European Symposium on Reliability of Electron Devices, Fa - Bordeaux, France, France
Duration: 7 Oct 200310 Oct 2003

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